Could Apple’s dual-die CPU/GPU split for M5 Pro and Max…
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Could Apple’s dual-die CPU/GPU split for M5 Pro and Max let it update just one die per year, putting each on an alternating two-year cycle?
Technically, Apple’s dual-die direction could let the M Pro and Max family adopt a true “tick-tock” cadence: one generation updates the CPU tile, the next updates the GPU tile. That fits a world where process gains are slowing and full-chip redesigns deliver smaller returns, while modular tiles would let Apple target the parts of the SoC that need the most work each cycle and keep scaling higher-end parts from the same building blocks.
Economically, that could be even more important. Instead of taping out entirely new Pro and Max-class dies every cycle, Apple could reuse one side of the design and only refresh the other, cutting the number of major die designs roughly in half. That means lower design churn, better reuse across the lineup, and a more efficient way to sustain annual upgrades even as advanced silicon gets more expensive.
#technology #hardware
Technically, Apple’s dual-die direction could let the M Pro and Max family adopt a true “tick-tock” cadence: one generation updates the CPU tile, the next updates the GPU tile. That fits a world where process gains are slowing and full-chip redesigns deliver smaller returns, while modular tiles would let Apple target the parts of the SoC that need the most work each cycle and keep scaling higher-end parts from the same building blocks.
Economically, that could be even more important. Instead of taping out entirely new Pro and Max-class dies every cycle, Apple could reuse one side of the design and only refresh the other, cutting the number of major die designs roughly in half. That means lower design churn, better reuse across the lineup, and a more efficient way to sustain annual upgrades even as advanced silicon gets more expensive.
#technology #hardware
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